十層三階HDI板

Release time：2019-08-28 Editor author：Jin Zhi Zhu Read：26824

層數： 10L

板厚： 1.2mm

特殊要求：樹脂塞孔

表面處理：沉金

材料：FR-4 TG170

外層線寬/線距: 2.95/2.95mil

內層線寬/線距: 2.36/2.36mil

最小孔徑：盲孔0.1mm，埋孔0.2mm，通孔0.2mm

銅厚：外層1oz，內層0.5oz & 1oz

十層三階HDI板-1.jpg

Previous：六層普通通孔板 Next：四層沉金工控板

Statement: This article originates from the integration of Jin Zhizhuo's official website, such as copyright issues related to articles and manuscripts. Please contact us in time, and we will deal with them as soon as possible.
Title: Temperature Detection Method for Temperature Control Switches web：http://www.ultimatelifestylesuccess.com/news/12.html

Share to：

If you need to solve the problem urgently, please join us in Wechat Customer Service or Consulting Online Customer Service.

PCB Fabrication

Contact

Shenzhen Jinzhizuo Technology Co., Ltd.
Tel: 0755-29976660/29976665
Fax: 0755-29976677
E-mail：gtl@gtl-tech.com

Home PCB Layout Design PCB Fabrication SMT Patch News About GTL Contact GTL

Technological companies focusing on electronic design, PCB Layout design, PCB board making, SMT patch one-stop service

Sales Hotline：0755-2997 6660
Service Specialist：136 7015 5505
Email：gtl@gtl-tech.com
Add：Six Floors of Building B11, Hengfeng Industrial City, Hezhou, Hangcheng Street, Baoan District, Shenzhen

微信公眾號

十層三階HDI板

選擇下列客服馬上在線溝通：